Essentials
|
Capacity |
1200 GB |
Status |
Launched |
Launch Date |
Q3'16 |
Lithography Type |
3D NAND G1 MLC |
Performance
|
Sequential Read (up to) |
1700 MB/s |
Sequential Write (up to) |
1300 MB/s |
Random Read (100% Span) |
320000 IOPS |
Random Write (100% Span) |
26000 IOPS |
Latency - Read |
20 µs |
Latency - Write |
20 µs |
Power - Active |
Avg. 11W (Write), 9W (Read) |
Power - Idle |
4W |
Reliability
|
Vibration - Operating |
2.17 GRMS |
Vibration - Non-Operating |
3.13 GRMS |
Shock (Operating and Non-Operating) |
1000 G/0.5msec |
Operating Temperature Range |
0°C to 55°C |
Endurance Rating (Lifetime Writes) |
1480 TBW |
Mean Time Between Failures (MTBF) |
2 million hours |
Uncorrectable Bit Error Rate (UBER) |
1 sector per 10^17 bits read |
Warranty Period |
5 yrs |
Package Specifications
|
Weight |
Up to 190gm |
Form Factor |
HHHL (CEM2.0) |
Interface |
PCIe NVMe 3.0 x4 |
Advanced Technologies
|
Enhanced Power Loss Data Protection |
Yes |
Hardware Encryption |
AES 256 bit |
High Endurance Technology (HET) |
No |
Temperature Monitoring and Logging |
Yes |
End-to-End Data Protection |
Yes |