Essentials |
Status |
End of Life |
Launch Date |
Q3'11 |
Sequential Read |
270 MB/s |
Sequential Write |
210 MB/s |
Random Read (100% Span) |
38500 IOPS |
Random Write (100% Span) |
2000 IOPS |
Latency - Read |
75 µs |
Latency - Write |
85 µs |
Power - Active |
3.7 W (64K Sequential Write) |
Power - Idle |
700 mW (Non-DIPM) |
Vibration - Operating |
2.17 GRMS (5-700 Hz) |
Vibration - Non-Operating |
3.13 GRMS (5-800 Hz) |
Shock (Operating and Non-Operating) |
1,500 G/.5 msec |
Operating Temperature Range |
0°C to 70°C |
Weight |
up to 80 ± 2 grams |
Mean Time Between Failures (MTBF) |
2,000,000 Hours |
Uncorrectable Bit Error Rate (UBER) |
1 sector per 1016 |
Recommended Customer Price |
N/A |
Package Specifications |
Components |
Intel NAND Flash Memory Multi-Level Cell (MLC) Technology |
Capacity |
300 GB |
Form Factor |
2.5" 7mm |
Interface |
SATA 3.0 3Gb/S |
Lithography Type |
25 nm |
Advanced Technologies |
Enhanced Power Loss Data Protection |
Yes |
Hardware Encryption |
AES 128 bit |
?High Endurance Technology (HET) |
Yes |
Temperature Monitoring and Logging |
Yes |
End-to-End Data Protection |
No |