- High Thermal Conductivity - The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
- Easy to Apply - Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
- All-In-One Application Kit - This thermal compound application kit includes a set of easily-applied tools for immediate use.
- Sustainability and Safety - The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.
P/N | CL-O023-GROSGM-A |
THERMAL CONDUCTIVITY | 4.5 W/m-k |
COLOR | Gray |
WEIGHT | 4g |
VISCOSITY | 76 Pa-s |
THERMAL IMPEDANCE | 0.185°C -in²/W |
DENSITY | 2.55 g/cm³ |